Key principles.
Cu vs Al
Copper 401 W/m·K vs aluminum 235. Copper better thermal but heavier and pricier.
2-5 mm spacing
Standard fin pitch 2-5 mm. Closer for forced air, wider for natural convection.
3-5× base
Fin height 3-5× base thickness. Diminishing returns above this.
3-6 mm
Base thickness affects spreading. 3 mm minimum for compact, 5 mm for larger sinks.
≤ 8:1
Fin aspect ratio (height/thickness). Above 8:1, manufacturing difficult, marginal benefit.
Add 30%
Black anodize improves radiation heat transfer. ~30% improvement at moderate temps.
FAQ
Extrusion: cheap for high volume. CNC: precision, custom shapes, low volume. Hybrid: extrusion + CNC machining for features.
Natural: open fin spacing, vertical orientation. Forced: tighter fins, fan-driven, optimized for specific airflow.
Heat pipes embedded for high-flux spreading. Specialty, expensive, but enables extreme designs.
Cold plate with liquid: 5-10× thermal capability of finned air sink. Specialty for high-power applications.
Anodize (Type II) preserves thermal but adds emissivity. Type III hardcoat slightly reduces conductivity. Bead blast OK for both.
For high-power critical applications yes. For typical consumer electronics, design rules sufficient. We can refer to thermal partners.
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